BEVEL POLISHING TOOLS
YIELD ENHANCEMENT BY REMOVING DEFECTS FROM THE BEVEL
Originating from the advances EBARA made in its wafer cleaning concepts, the EAC Bevel Tool combines these ideas with the capability to polish and shape the wafer Bevel.
Whether you utilize Deep Trench Etching or are Power Device maker, the need to remove these defects, chips, etch damage is essential. This damage at the wafer edge is reported and known as the root cause for wafer yield loss.
EBARA have developed a tool that not only cleans but can also reshape the Bevel to a specific profile by using a mechanical ‘slurry free’ process that has been confirmed to be effective in maintaining production yield.
The EAC300bi series is a fully automated system for high volume production and accommodates 200 and 300mm wafer sizes.
Capable of polishing film stacks or bare Silicon wafers and without the need of slurry or protective film for the device side. The tool design delivers the customer a competitive solution for Bevel edge treatments.
The EAC300bi tool has two polish modules capable of polishing both the bevel and wafer notch. Through the tool software the user can tailor the bevel profile to specific requirements.
The EAC300bi series is equipped with the same technology as used in EBARA’s CMP platforms which consists of a robust post polish 2 step clean process incorporating front/back side cleaning capability with a final spin rinse dry.
The EAC300bi is equipped with a fully automated load/unload station as a backbone for our manufacturing.