Efficiency
Challenge in miniaturization
EBARA’s CMP systems enable 300-millimeter semiconductor
wafers to be miniaturized and made ultra-smooth, down
to the 10- to 20-nanometer level.
Experience
EBARA offers 4 platen platforms for CMP Systems since 2003
High flexibility and keeping the advance end point over the years by following the Moore law, EBARA stands for best solutions.
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